View GMC40XXXX_442982.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Cal-Chip
Electronics, Incorporated Multilayer Ceramic Chip Capacitors
Introduction
GMC SERIES
Multilayer Surface Mount Ceramic Capacitors are constructed by screen printing alternative layers of internal metallic electrodes onto ceramic dielectric materials and firing into a concrete monolithic body, then completed by application of metal end terminations which are fired to assure permanent bonding with the individual internal electrodes. Multilayer ceramic capacitors have various features such as large capacitance values in small sizes and excellent high frequency characteristics. Moreover, chip capacitors can be used on surface mount assembly equipment. Our fully integrated manufacturing and total quality control systems ensure unprecedented high standards of quality and reliability.
Chip Capacitor Selection
Dielectric Type
The choice of dielectric is largely determined by the temperature stability required.
Selection of the most suitable capacitor for any application is based on the following:
COG (NPO)
Capacitance change with temperature is 0-30ppm/C which is less than -0.3%C from -55C to +125C. Typical capacitance change with life is less than -0.1% for NPOs, one-fifth that shown by most other dielectrics. NPO formulations show no aging characteristics.
X7R/X5R
Its temperature variation of capacitance is within 15% from -55C to +125C (-55C to +85C for X5R). The capacitance change is non-linear.
Z5U
Despite their capacitance instability, Z5U formulations are very popular because of their small size, temperature range low ESL, low ESR and excellent frequency response. These features are particularly important for decoupling application where only a minimum capacitance value is required.
Y5V
Y5V formulations are for general purpose use in a limited temperature range. They have a wide temperature characteristic of +22% - 82% capacitance change over the operating temperature range of -30C to +85C. Y5Vs high dielectric constant allows the manufacture of very high capacitance values (up to 22MF) in small physical sizes.
Capacitance Value & Tolerance
Determined by circuit requirements. Note that chip prices decrease with lower capacitance value and looser tolerance.
Voltage
Determined by circuit requirements. Units are designed to exceed the withstanding voltage specification, i.e., the user need not incorporate an additional safety margin.
w
w
.D w
t a
S a
e h
t e
U 4
.c
m o
Capacitor Size
Select the smallest unit permitted by the circuit constraints that provides the required capacitance and voltage rating. All Cal-Chip capacitors conform to EIA specifications.
Capacitor Termination
Termination choice is largely determined by the chip attachment method. Silver-palladium is adequate for most applications involving soldering or solder reflow. Nickel barrier is standard and recommended for units exposed to repeated solder cycles, to minimize leaching of the termination.
w
w
w
.D
a
aS t
ee h
4U t
om .c
Cal-Chip
Construction
Electronics, Incorporated
GMC SERIES
Multilayer Ceramic Chip Capacitors
Solder(SN/PB) plated outer layer; typical thickness 0.003mm to 0.005mm 90% solder, 10% lead.*(please see note)
Nickel Barrier Layer (50 Micro-inches Electroplated Nickel min.) Ag Layer Inner Electrodes
Example GMC21
Size Code
CG
Dielectric
102
Capacitance (pF)
J
Capacitance Tolerance (EIA Code)
50
Voltage
N
Termination
T
Packaging Code
M
CG (COG) (NPO) X7R or X5R Z5U Y5V Capacitance values are represented in 3 digits, and expressed in pF. The first two digits are significant, and the third is the number of zeros. The letter "R" is used as a decimal point.
0R5 5R0 100 101 102 103 104 105 106
0.5pF 5pF 10pF 100pF 1000pF .01mF .1mF 1.0mF 10mF
B C D F G J K M Z
0.1pf for < 10pF 0.25pF for < 10pF 0.5pF for < 10pF 1% 2% 5% 10% 20% -20%~+80%
6r3 10 16 25 50 100 200
6.3 DC 10 DC 16 DC 25 DC 50 DC 100 DC 200 DC
N
Nickel Barrier T Tape and Reel TLF Lead Free*
*Note for Lead Free: Cal-Chip is beginning to phase in Lead-Free products. Upon checking availabilty with the factory, please specify "TLF" at the end of the part number.
Multilayer Ceramic Chip Capacitors
0201
DIMENSION (MM)
GMC02
0.6 0.03 0.3 0.03 0.3 0.03 0.15 0.05 NPO/COG 25 X5R 6.3 10 6.3 X7R 10 16 Y5V/Z5U 6.3
L W T(MAX) BW
dielectric
Rated Voltage Cap. Range 0.5pF 0R5 1.0 1R0 1.2 1R2 1.5 1R5 1.8 1R8 2.2 2R2 2.7 2R7 3.3 3R3 3.9 3R9 4.7 4R7 5.6 5R6 6.8 6R8 8.2 8R2 10 100 12 120 15 150 18 180 22 220 27 270 33 330 39 390 47 470 56 560 68 680 82 820 100 101 120 121 150 151 180 181 220 221 270 271 330 331 390 391 470 471 560 561 680 681 820 821 1.0nF 102 1.2 122 1.5 152 1.8 182 2.2 222 2.7 272 3.3 332 3.9 392 4.7 472 5.6 562 6.8 682 8.2 822 10 103 12 123 15 153 18 183 22 223 27 273 33 333 39 393 47 473 56 563 68 683 82 823 100 104 120 124 150 154 180 184 220 224 270 274 330 334 390 394 470 474 560 564 680 684 820 824 1.0uF 105 2.2 225
Multilayer Ceramic Chip Capacitors
0402 & 0603
GMC04
Type Length (L1) Width (W) 0402 mm inches mm inches
GMC10
0603
Thickness (H) mm inches Termination Band (L2+L3) mm inches Band Gap (L4)mm (Min) inches Dielectric Rated Voltage d.c.
Cap Range 0.5pF 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 150 220 270 330 390 470 560 680 820 1.0uF 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 15 22 33 47 Code 0R5 1R0 1R2 1R5 1R8 2R2 2R7 3R3 3R9 4R7 5R6 6R8 8R2 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 154 224 274 334 394 474 564 684 824 105 225 275 335 395 475 565 685 825 106 156 226 336 476
1.0 0.05 0.04 0.002 0.5 0.05 0.02 0.002 0.5 0.1 0.02 0.004 Min 0.1 0.004 0.3 0.012
COG
25 50 6.3
1.6 0.063 0.8 0.031 0.8 0.031 Max 0.35 0.014 Min 0.1 0.004
0.2 0.008 0.2 0.008 0.2 0.008 Max 0.4 0.015
0.6 0.015
Y5V & Z5U
25 50 6.3 10 16 25 50 25
X5R
10 16 6.3 10
X7R
16
COG
X5R
X7R
50/
Y5V & Z5U
16 25 50
50 100 6.3 10 16 6.3 10 16 25 100 6.3 10
Multilayer Ceramic Chip Capacitors
COG/NPO
GMC21
Type
mm Inches Width mm Inches Thickness mm Inches Termination Band mm Inches Band Gap mm Inches Rated Voltage d.c.
Cap. Range 0.5pF 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0uF 2.2 3.3 4.7 6.8 10 22 33 47 100 Code 0R5 1R0 1R2 1R5 1R8 2R2 2R7 3R3 3R9 4R7 5R6 6R8 8R2 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 225 335 475 685 106 226 336 476 107
GMC31
1206
3.2 0.3 0.125 0.012 1.6 0.2 0.063 0.008 1.6 0.063 Max Min 0.75 0.25 0.03 0.01 1.4 0.055
25 50
GMC32
1210
3.2 0.3 0.125 0.012 2.5 0.3 0.10 0.012 1.8 0.07 Max Min 0.25 0.75 0.01 0.03 1.4 0.055
16 25 50/63
GMC40
1808
4.57 0.25 0.18 0.01 2.03 0.25 0.08 0.01 2.03 0.08 Max Min 0.75 0.25 0.03 0.01 2.0 0.078
50/63
GMC43
1812
4.5 0.35 0.18 0.014 3.2 0.3 0.125 0.012 1.8 0.07 Max Min 0.75 0.25 0.03 0.01 2.2 0.087
50/63
GMC45
1825
4.5 0.35 0.18 0.014 6.3 0.4 0.25 0.016 1.8 0.07 Max Min 0.25 0.75 0.01 0.03 2.2 0.087
50/63
GMC55
2220
5.7 0.4 0.225 0.016 5.0 0.4 0.197 0.016 1.8 0.07 Min Max 0.25 0.75 0.01 0.03 2.9 0.114
50/63
GMC57
2225
5.7 0.4 0.225 0.016 6.3 0.4 0.25 0.016 1.8 0.07 Max Min 0.75 0.25 0.03 0.01 2.9 0.114
50/63
0805
2.0 0.3 0.08 0.012 1.25 0.2 0.05 0.008 1.3 0.051 Min Max 0.75 0.25 0.03 0.01 0.5 0.019
16 25 50
Length
Multilayer Ceramic Chip Capacitors
COG/NPO (cont.)
GMC21
Type
Length mm Inches Width mm Inches Thickness mm Inches Termination Band mm Inches Band Gap mm Inches Rated Voltage d.c.
Cap. Range 0.5pF 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0uF 2.2 3.3 4.7 6.8 10 22 33 47 68 100 Code 0R5 1R0 1R2 1R5 1R8 2R2 2R7 3R3 3R9 4R7 5R6 6R8 8R2 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 225 335 475 685 106 226 336 476 686 107
GMC31
1206
3.2 0.3 0.125 0.012 1.6 0.2 0.063 0.008 1.6 0.063 Max Min 0.75 0.25 0.03 0.01 1.4 0.055
GMC32
1210
3.2 0.3 0.125 0.012 2.5 0.3 0.10 0.012 1.8 0.07 Max Min 0.25 0.75 0.01 0.03 1.4 0.055
GMC40
1808
4.57 0.25 0.18 0.01 2.03 0.25 0.08 0.01 2.03 0.08 Max Min 0.75 0.25 0.03 0.01 2.0 0.078
GMC43
1812
4.5 0.35 0.18 0.014 3.2 0.3 0.125 0.012 1.8 0.07 Max Min 0.75 0.25 0.03 0.01 2.2 0.087
GMC45
1825
4.5 0.35 0.18 0.014 6.3 0.4 0.25 0.016 1.8 0.07 Max Min 0.25 0.75 0.01 0.03 2.2 0.087
GMC55
2220
5.7 0.4 0.225 0.016 5.0 0.4 0.197 0.016 1.8 0.07 Min Max 0.25 0.75 0.01 0.03 2.9 0.114
GMC57
2225
5.7 0.4 0.225 0.016 6.3 0.4 0.25 0.016 1.8 0.07 Max Min 0.75 0.25 0.03 0.01 2.9 0.114
0805
2.0 0.3 0.08 0.012 1.25 0.2 0.05 0.008 1.3 0.051 Min Max 0.75 0.25 0.03 0.01 0.5 0.019
100
200
100
200
100
200
100
200
100
200
100
200
100
200
100
200
Multilayer Ceramic Chip Capacitors
X7R
GMC21
Type
Length
GMC31
1206
GMC32
1210
3.2 0.3 0.125 0.012 2.5 0.3 0.10 0.012 1.8 0.07 Max Min 0.25 0.75 0.01 0.03 1.4 0.055
10 16 25
GMC40
1808
4.57 0.25 0.18 0.01 2.03 0.25 0.08 0.01 2.03 0.08 Max Min 0.75 0.25 0.03 0.01 2.0 0.078
10 16 25
GMC43
1812
4.5 0.35 0.18 0.014 3.2 0.3 0.125 0.012 1.8 0.07 Max Min 0.75 0.25 0.03 0.01 2.2 0.087
10 16 25
GMC45
1825
4.5 0.35 0.18 0.014 6.3 0.4 0.25 0.016 1.8 0.07 Max Min 0.25 0.75 0.01 0.03 2.2 0.087
10 16 25
GMC55
2220
5.7 0.4 0.225 0.016 5.0 0.4 0.197 0.016 1.8 0.07 Min Max 0.25 0.75 0.01 0.03 2.9 0.114
10 16 25
GMC57
2225
5.7 0.4 0.225 0.016 6.3 0.4 0.25 0.016 1.8 0.07 Max Min 0.75 0.25 0.03 0.01 2.9 0.114
10 16 25
0805
mm 2.0 0.3 3.2 0.3 Inches 0.08 0.012 0.125 0.012 Width mm 1.25 0.2 1.6 0.2 Inches 0.05 0.008 0.063 0.008 Thickness mm 1.3 1.6 Inches 0.051 0.063 Max Min Min Max Termination Band 0.75 0.75 0.25 0.25 mm 0.03 0.03 0.01 0.01 Inches Band Gap mm 0.5 1.4 Inches 0.019 0.055 Rated Voltage d.c. 6.3 10 16 25 6.3 10 16 25
Cap. Range 0.5pF 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0uF 2.2 3.3 4.7 6.8 10 22 33 47 68 100 Code 0R5 1R0 1R2 1R5 1R8 2R2 2R7 3R3 3R9 4R7 5R6 6R8 8R2 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 225 335 475 685 106 226 336 476 686 107
Multilayer Ceramic Chip Capacitors
X7R (cont)
GMC21
Type
mm Inches Width mm Inches Thickness mm Inches Termination Band mm Inches Band Gap mm Inches Rated Voltage d.c.
Cap. Range 0.5pF 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0uF 2.2 3.3 4.7 6.8 10 22 Code 0R5 1R0 1R2 1R5 1R8 2R2 2R7 3R3 3R9 4R7 5R6 6R8 8R2 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 225 335 475 685 106 226
GMC31
1206
3.2 0.3 0.125 0.012 1.6 0.2 0.063 0.008 1.6 0.063 Max Min 0.75 0.25 0.03 0.01 1.4 0.055
50 100 200
GMC32
1210
3.2 0.3 0.125 0.012 2.5 0.3 0.10 0.012 1.8 0.07 Max Min 0.25 0.75 0.01 0.03 1.4 0.055
50 100 200
GMC40
1808
4.57 0.25 0.18 0.01 2.03 0.25 0.08 0.01 2.03 0.08 Max Min 0.75 0.25 0.03 0.01 2.0 0.078
50 100 200
GMC43
1812
4.5 0.35 0.18 0.014 3.2 0.3 0.125 0.012 1.8 0.07 Max Min 0.75 0.25 0.03 0.01 2.2 0.087
50 100 200
GMC45
1825
4.5 0.35 0.18 0.014 6.3 0.4 0.25 0.016 1.8 0.07 Max Min 0.25 0.75 0.01 0.03 2.2 0.087
50 100 200
GMC55
2220
5.7 0.4 0.225 0.016 5.0 0.4 0.197 0.016 1.8 0.07 Min Max 0.25 0.75 0.01 0.03 2.9 0.114
50 100 200
GMC57
2225
5.7 0.4 0.225 0.016 6.3 0.4 0.25 0.016 1.8 0.07 Max Min 0.75 0.25 0.03 0.01 2.9 0.114
50 100 200
0805
2.0 0.3 0.08 0.012 1.25 0.2 0.05 0.008 1.3 0.051 Min Max 0.75 0.25 0.03 0.01 0.5 0.019
50 100 200
Length
Multilayer Ceramic Chip Capacitors
X5R
GMC21
Type
Length mm Inches Width mm Inches Thickness mm Inches Termination Band mm Inches Band Gap mm Inches Rated Voltage d.c.
Cap. Range 0.5pF 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0uF 2.2 3.3 4.7 6.8 10 22 33 47 100 Code 0R5 1R0 1R2 1R5 1R8 2R2 2R7 3R3 3R9 4R7 5R6 6R8 8R2 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 225 335 475 685 106 226 336 476 107
GMC31
1206
3.2 0.3 0.125 0.012 1.6 0.2 0.063 0.008 1.6 0.063 Max Min 0.75 0.25 0.03 0.01 1.4 0.055
6.3 10 16 25
GMC32
1210
3.2 0.3 0.125 0.012 2.5 0.3 0.10 0.012 1.8 0.07 Max Min 0.25 0.75 0.01 0.03 1.4 0.055
6.3 10 16
GMC40
1808
4.57 0.25 0.18 0.01 2.03 0.25 0.08 0.01 2.03 0.08 Max Min 0.75 0.25 0.03 0.01 2.0 0.078
N/A
GMC43
1812
4.5 0.35 0.18 0.014 3.2 0.3 0.125 0.012 1.8 0.07 Max Min 0.75 0.25 0.03 0.01 2.2 0.087
6.3 10 16
GMC45
1825
4.5 0.35 0.18 0.014 6.3 0.4 0.25 0.016 1.8 0.07 Max Min 0.25 0.75 0.01 0.03 2.2 0.087
N/A
GMC55
2220
5.7 0.4 0.225 0.016 5.0 0.4 0.197 0.016 1.8 0.07 Min Max 0.25 0.75 0.01 0.03 2.9 0.114
N/A
GMC57
2225
5.7 0.4 0.225 0.016 6.3 0.4 0.25 0.016 1.8 0.07 Max Min 0.75 0.25 0.03 0.01 2.9 0.114
N/A
0805
2.0 0.3 0.08 0.012 1.25 0.2 0.05 0.008 1.3 0.051 Min Max 0.75 0.25 0.03 0.01 0.5 0.019
6.3 10 16
Multilayer Ceramic Chip Capacitors
Y5V/Z5U
GMC21
Type
Length mm Inches Width mm Inches Thickness mm Inches Termination Band mm Inches Band Gap mm Inches Rated Voltage d.c.
Cap. Range 0.5pF 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0uF 2.2 3.3 4.7 6.8 10 22 33 47 68 100 Code 0R5 1R0 1R2 1R5 1R8 2R2 2R7 3R3 3R9 4R7 5R6 6R8 8R2 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 225 335 475 685 106 226 336 476 686 107
GMC31
1206
3.2 0.3 0.125 0.012 1.6 0.2 0.063 0.008 1.6 0.063 Max Min 0.75 0.25 0.03 0.01 1.4 0.055
6.3 10 16 25
GMC32
1210
3.2 0.3 0.125 0.012 2.5 0.3 0.10 0.012 1.8 0.07 Max Min 0.25 0.75 0.01 0.03 1.4 0.055
6.3 10 16 25
GMC40
1808
4.57 0.25 0.18 0.01 2.03 0.25 0.08 0.01 2.03 0.08 Max Min 0.75 0.25 0.03 0.01 2.0 0.078
6.3 10 16 25
GMC43
1812
4.5 0.35 0.18 0.014 3.2 0.3 0.125 0.012 1.8 0.07 Max Min 0.75 0.25 0.03 0.01 2.2 0.087
6.3 10 16 25
GMC45
1825
4.5 0.35 0.18 0.014 6.3 0.4 0.25 0.016 1.8 0.07 Max Min 0.25 0.75 0.01 0.03 2.2 0.087
6.3 10 16 25
GMC55
2220
5.7 0.4 0.225 0.016 5.0 0.4 0.197 0.016 1.8 0.07 Min Max 0.25 0.75 0.01 0.03 2.9 0.114
6.3 10 16
GMC57
2225
5.7 0.4 0.225 0.016 6.3 0.4 0.25 0.016 1.8 0.07 Max Min 0.75 0.25 0.03 0.01 2.9 0.114
10 16 25
0805
2.0 0.3 0.08 0.012 1.25 0.2 0.05 0.008 1.3 0.051 Min Max 0.75 0.25 0.03 0.01 0.5 0.019
6.3 10 16 25
25 6.3
Multilayer Ceramic Chip Capacitors
Y5V/Z5U (cont)
GMC21
Type
mm Inches Width mm Inches Thickness mm Inches Termination Band mm Inches Band Gap mm Inches Rated Voltage d.c.
Cap. Range 0.5pF 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0nF 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1.0uF 2.2 3.3 4.7 6.8 10 22 33 47 68 100 Code 0R5 1R0 1R2 1R5 1R8 2R2 2R7 3R3 3R9 4R7 5R6 6R8 8R2 100 120 150 180 220 270 330 390 470 560 680 820 101 121 151 181 221 271 331 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 225 335 475 685 106 226 336 476 686 107
GMC31
1206
3.2 0.3 0.125 0.012 1.6 0.2 0.063 0.008 1.6 0.063 Max Min 0.75 0.25 0.03 0.01 1.4 0.055
50 100 200
GMC32
1210
3.2 0.3 0.125 0.012 2.5 0.3 0.10 0.012 1.8 0.07 Max Min 0.25 0.75 0.01 0.03 1.4 0.055
50 100 200
GMC40
1808
4.57 0.25 0.18 0.01 2.03 0.25 0.08 0.01 2.03 0.08 Max Min 0.75 0.25 0.03 0.01 2.0 0.078
50 100 200
GMC43
1812
4.5 0.35 0.18 0.014 3.2 0.3 0.125 0.012 1.8 0.07 Max Min 0.75 0.25 0.03 0.01 2.2 0.087
50 100 200
GMC45
1825
4.5 0.35 0.18 0.014 6.3 0.4 0.25 0.016 1.8 0.07 Max Min 0.25 0.75 0.01 0.03 2.2 0.087
50 100 200
GMC55
2220
5.7 0.4 0.225 0.016 5.0 0.4 0.197 0.016 1.8 0.07 Min Max 0.25 0.75 0.01 0.03 2.9 0.114
50 100 200
GMC57
2225
5.7 0.4 0.225 0.016 6.3 0.4 0.25 0.016 1.8 0.07 Max Min 0.75 0.25 0.03 0.01 2.9 0.114
50 100 200
0805
2.0 0.3 0.08 0.012 1.25 0.2 0.05 0.008 1.3 0.051 Min Max 0.75 0.25 0.03 0.01 0.5 0.019
50 100 200
Length
Cal-Chip
Electronics, Incorporated
GMC SERIES
Multilayer Ceramic Chip Capacitors COG Dielectric
Ultra stable class I dielectric: linear temperature coefficient, low loss, negligible change of electrical properties with time, voltage and frequency.
Operating Temperature Range -55C to +125C Temperature Coefficient Temperature Voltage Coefficient (cMax @ VDCW) 030ppm/C Dissipation Factor Insulation Resistance Dielectric withstanding Voltage 3 X VDCW Test Parameters
Aging Rate
030ppmC
0.1% Max, * 25C, VDCW:: 0.02% Typical >100GF or 1000F, whichever is less *125C, VDCW: >10GF or 100F whichever is less
0% per decade hour
* C1000pF f=1MHz V=1.0Vrms 0.2Vrms T=25C * C>1000pF f=1KHz V=1.0Vrms 0.2Vrms T=25C
X7R Dielectric
Stable class II dielectric (EIA X7R)
Operating Temperature Range -55C to +125C Temperature Coefficient Temperature Voltage Coefficient (cMax @ VDCW) Dissipation Factor Insulation Resistance Dielectric withstanding Voltage 2.5 X VDCW Test Parameters
Aging Rate
15%
X7R 2.5% Max, * 25C, VDCW:: Not Applicable 1.8% Typical >100GFor 1000F, whichever is less *125C, VDCW: >10GF or 100F whichever is less
<2% per decade hour
1KHz, 1.0Vrms 0.2Vrms 25C values > or = to 10uF 1.0Vrms 120Hz
10
Cal-Chip
Operating Temperature Range -30C to +85C
Electronics, Incorporated
GMC SERIES
Multilayer Ceramic Chip Capacitors - Z5U (Y5V) Dielectric
High capacitance per unit volume: general purpose product
Temperature Coefficient +22% -82% Dissipation Factor 3.0% Max, 2.0% Typical Insulation Resistance 10G or 100F whichever is less, 25C, VDCW Dielectric withstanding Voltage 2.5 X VDCW Aging Rate 3.0% per decade hour Test Parameters
1KHz, 1Vrms 25C
values > or = to 10uF 1.0Vrms 120Hz
Packaging (Taping)
(Reel Type-Size)
Standard Reel
Unit:mm
A
o178 2.0
B
o50 min.
C
o13.0 0.5
D
o21.0 0.8
E
2.0 0.5
W
14.9 1.5
t
0.8 0.2
R
1.0
10000 units per reel OPTIONAL
Unit:mm
A
o250 2.0
B
o50 min.
C
o13.0 0.5
D
o21.0 0.8
E
2.0 0.5
W
10.0 1.5
t
0.8 0.2
R
1.0
Carrier Tape (Standard) Top Cover Tape
* To peel off the cover tape by the method shown in the right figure apply a peel-off force of 20 gf - 60 gf (card board); 35 gf - 75 gf (plastic tape). * The cover tape should not touch the top or bottom of the chip. * If the cover tape has been peeled off it may be difficult to remove the chip due to punch-hole clearance, dirt, and debris. Make sure therefore that no paper waste will adhere to and block the absorption nozzle. * If the cover tape has been peeled off from the top, stick it back on with a suitable adhesive. * Follow the illustration for the start and end of the winding operation.
165-180
Carrier Tape
Cover Tape tension direction Tape unreeling direction Bottom Cover Tape
Empty section
Chip Mounting section
Empty section
Leader section Start
{
50 pitch (200mm)
{ {
30 pitch (120mm) 200mm
Unreeling direction
{
11
Cal-Chip
Type A
0402 0603 0805 1206
Electronics, Incorporated
GMC SERIES
Unit: mm
Mounting Hole Quantity per Reel 10000 4000 4000 to 5000* 4000 to 5000*
Multilayer Ceramic Chip Capacitors
* Cardboard carrier tape for 0402, 0603 type and 0805/1206 type B W
0.70.2 1.10.2 1.650.2 2.00.2
F E
1.30.2 1.90.2 2.40.2 3.60.2
P1 P2
P0 D0
t1 t2
2.00.05
8.00.3 3.50.05 1.750.1 4.00.1 2.00.05 4.00.1 o1.5+0.1 1.1 max 1.4 max
-0
Angular Punch Hole
*Dependent on chip thickness
* Embossed plastic carrier tape for 0805/1206 type and 1210 type Type
0805 1206 1210
Unit: mm D0 t1 t2
Mounting Hole Angular Embossed Hole Quantity per Reel 2000 to 5000* 2000 to 5000* 2000 to 4000*
A
B
W
F
E
P1
P2
P0
1.450.2 2.30.2 2.00.2 3.60.2 2.90.2 3.60.2
8.00.3 3.50.05 1.750.1 4.00.1 2.00.05 4.00.1 o1.5+0.1 0.6 max 2.5 max
-0
*Dependent on chip thickness
* Embossed plastic carrier tape for 1812, 1825, 2220 and 2225 type Type
1812 1825 2220 2225
Unit: mm D0 t1 t2
Mounting Hole Angular Embossed Hole 1000 Quantity per Reel 1000 1000 1000
A
3.60.2 6.80.3 5.50.3 6.80.3
B
4.90.2 4.90.2 6.20.3 6.20.3
W
F
E
P1
8.00.1
P2
2.00.05
P0
4.00.1
12.00.3 5.50.05 1.750.1
o1.50. 0.6 max. 6.5 max. 1
*Dependent on chip thickness
12
Cal-Chip
Electronics, Incorporated
GMC SERIES
Multilayer Ceramic Chip Capacitors - All Dielectrics
Tape and Reel Packing Quantities
Chip Size 0402 0603 0805 1206 1210 1812 1825 2220 2225 178 mm (7") Reel 10,000 4,000 4,000 4,000 2,000 , 4,000 1,000 1,000 1,000 1,000 330 mm (13") Reel N/A 16,000 12,000 15,000 8,000 4,000 4,000 4,000 4,000
The tape and reel packing quantities apply to voltages up to 200V rating only. The 0402 and 0603 size chips have similar width and thickness dimensions.
13
Cal-Chip
BULK CASE
Electronics, Incorporated
GMC SERIES
Multilayer Ceramic Chip Capacitors
* Bulk case packaging can reduce the stock space and transportation costs. * The bulk feeding system can increase the productivity. * It can eliminate the components loss.
* Structure and Dimension
Symbol
Dimension
A
6.80.1
B
8.80.1
T
120.1
C
1.5+0.1, -0
D
2+0, -0.1
E
4.70.1
Symbol
Dimension
F
31.5+0.2, -0
W
36+0. -0.2
G
190.35
H
70.35
L
1100.7
I
50.35
* Quantity
Size Quantity 04(0402) 80,000 10(0603) 15,000 10,000 21(0805) T0.85mm T1.0mm 5,000
14
Cal-Chip
Electronics, Incorporated
GMC SERIES
Test Method * Class (I) C<1000pF:1MHz10%, 0.5 to 5Vrms C1000pF:1KHz10%, 1.00.2Vrms * Class (II) 1KHz10%, 1.00.2Vrms
values > or = to 10uF 1.0Vrms 120Hz
Multilayer Ceramic Chip Capacitors
RELIABILITY AND TEST
CONDITIONS
Item Capacitance
Specification Within tolerance shown by part number code * Class (I) C<30pF:Q400+20xC C30pF:Q1000 * Class (II) X7R:DF2.5% Y5V/Z5U:DF3.0% NPO-XR7: C50,000pF: IR100G C>50,000pF: IR500M. Per Uf. Y5V/Z5U: IR10G There shall be no evidence of damage or flash over during the test
Dissipation Factor (tan or Q)
Insulation Resistance(IR)
Apply rated voltage for 60 seconds at room temperature and normal humidity. (70% RH max) Apply 3 x rated voltage (Class I) or 2.5 x rated voltage (Class II) to both terminations for 5 seconds. Charge and discharge current are less than 50mA.
Dielectric Withstanding Voltage
Termination Adherence
No mechanical damage
Care shall be taken to avoid thermal shock. 500g of steady pull is applied in direction of arrow for 1 minute. Bend Strength No mechanical damage After soldering capacitor on the glass-epoxy PWB, 2 mm of vending shall be applied for 10 seconds as shown by drawing.
Life Test (High Temperature Loading Test)
C
* Class (I) No more than 3% or 0.3pF whichever is less * Class (II) X7R:10% max Y5V/Z5U:30% max * Class (I) C<10pF:Q>200+10xC 10C<30pF:Q275+5/2xC C30pF:Q350 * Class (II) X7R:DF5.0% Y5V/Z5U:DF7.5% 1000M or 50F, min whichever is less
Q or DF
Applied 2 x rated voltage at maximum operating temperature for 1000 hours. The surge current shall not exceed 50mA after above testing condition, test samples shall be kept in room temperature for 24 hours (Class I) or 48 hours (Class II), and then shall be measured.
IR
15
Cal-Chip
Electronics, Incorporated
GMC SERIES
Specification Test Method
Multilayer Ceramic Chip Capacitors
RELIABILITY AND TEST
CONDITIONS
Item Moisture Test
C
Q or DF
* Class (I) No more than 5% or 0.5pF whichever is larger * Class (II) X7R:10% Y5V/Z5U:30% * Class (I) C<10pF:Q>200+10xC 10C<30pF:Q275+5/2xC C30pF:Q350 * Class (II) X7R:DF5.0% Y5V/Z5U:DF7.5% 1000M or 50F, whichever is less
The capacitors shall be subjected to 40C, 90-95%RH for 500 hours. After above testing condition, samples shall be kept in room temperature for 24 hours (Class I) or 48 hours (Class II), and then shall be measured.
IR
Moisture Resistance Test
* Class (I) No more than 7.5% or 0.75pF whichever is larger C * Class (II) X7R:10% Y5V/Z5U:30% * Class (I) C<30pF:Q>100+100/3xC Q C30pF:Q200 or * Class (II) DF X7R:DF5.0% Y5V/Z5U:DF7.5% 500M or 25F, min IR whichever is less * Class (I) No more than 2.5% or 0.25pF whichever is larger * Class (II) X7R:5% Y5V/Z5U:20% To satisfy the specified initial value. To satisfy the specified initial value. Termination area shall be at least 95% covered with a new solder coating. There shall be no crack and ceramic exposure of terminated surface by melting. * Class (I) No more than 2.5% or 0.25pF whichever is larger * Class (II) X7R:5% Y5V/Z5U:20% To satisfy the specified initial value. To satisfy the specified initial value.
Apply rated voltage at 40C, 90-95%RH for 500 hours. The surge current shall not exceed 50mA. After testing with above condition, samples shall be kept in room temperature for 24 hours (Class I) or 48 hours (Class II), and then shall be measured.
Temperature Cycle
C
Q or DF IR
Perform 5 cycles as follow: 1. Room temperature. Dwell for 15 minutes. 2. Minimum operating temperature, dwell for 30 minutes. 3. Room temperature, dwell for 30 minutes. 4. Maximum operating temperature, dwell for 30 minutes. After above testing condition, samples shall be kept in room temperature for 24 hours (Class I) or 48 hours (Class II), and then shall be measured. The capacitors are completely immersed during 40.5 seconds in the molten solder with a temperature of 2305C *Solder: Sn 63. Immerse into molten solder at 2705C for 30.5 seconds. Preheat before immersion. 1. 80~100C for 2 minutes. 2. 150~180C for 2 minutes. 3. 2705C for 30.5 seconds. The capacitance measurement shall be made after sample keeping at room temperature for 24 hours.
Solderability
Resistance to Solder Heat Test
C
Q or DF
16
IR
Cal-Chip
Electronics, Incorporated
GMC SERIES
Multilayer Ceramic Chip Capacitors
APPLICATION MANUAL FOR SURFACE MOUNTING
1. Temperature / Humidity Control Since dew condensation may occur by the differences in temperature when the products are take out of storage, it is important to maintain a temperaturecontrolled environment. 2. Design of Solder Land Pattern When designing printed circuit boards, the shape and size of the solder lands must allow for the proper amount of solder on the capacitor. The amount of solder at the end terminations has a direct effect on the probability that the chip will crack. The greater amount of solder, the larger amount of stress on the chip, and the more likely that it will break. Use the following illustrations as guidelines for proper solder land design. Recommendation of solder land shape and size.
3. Adhesives MLCCs generally require the use of an adhesive to adhere the chips to the circuit board prior to wave soldering. 3-1. Requirements for Adhesives - They must have enough adhesion so that the chips will not fall off or move during the handling of the circuit board. - They must maintain their adhesive strength when exposed to soldering temperatures. - They should not spread or run when applied to the circuit board. - They should have a long pot life. - They should harden quickly. - They should not corrode the circuit board or chip material. - They should be a good insulator. - They should be non-toxic, and not produce harmful gases, nor be harmful when touched. 3-2. Application Method It is important to use the proper amount of adhesive. Too little will cause poor adhesion to the circuit board, and too much may strain the conductor pattern, thereby causing defective soldering. The following illustrations show the proper quantity of adhesive.
(Unit: mm)
Type a b c
21 0.2 min 70~100m >0
31 0.2 min 70~100m >0
3-3. Adhesive Hardening Characteristics To prevent oxidation of the terminations, the adhesive must harden at 160C or less, within 2 minutes or less.
17
Cal-Chip
Electronics, Incorporated
GMC SERIES
Multilayer Ceramic Chip Capacitors
4. Mounting 4-1. Mounting Head Pressure Excessive pressure will cause chip capacitors to crack. The pressure between nozzle and chip capacitor will be 300g maximum during mounting. 4-2.Bending Stress Bending of printed circuit board by mounting head when double-sided circuit boards are used, chip capacitors first are mounted and soldered onto one side of the board. When the capacitors are mounted onto the other side, it is important to support the board as shown in the illustration. If the circuit board is not supported, it may bend, causing the already installed capacitors to crack.
5. Flux Although highly activated flux gives better solderability, substances which increase activity may also degrade the insulation of the chip capacitors. To avoid such degradation, it is recommended that a mildly activated rosin flux (less than 0.2% chlorine) be used. 6. Soldering Since a multilayer chip ceramic capacitor comes into direct contact with melted solder during soldering, it is exposed to potentially damaging mechanical stress caused by the sudden temperature change. The capacitor may also be subject to silver migration, and to contamination by the flux. Because of these factors, soldering technique is critical. 6-1. Soldering Methods Method Mass reflow Selective reflow Flow Soldering Dual Wave Classification * IR/Convection * VPS (Vapor phase) * Hot air/gas * Laser
Reflow Soldering
6-2. Soldering Profile To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph.
18
Cal-Chip
Electronics, Incorporated
GMC SERIES
Multilayer Ceramic Chip Capacitors
over 60 sec 10~20 sec over 60 sec
over 60 sec 2~3 sec over 60 sec
Reflow Soldering
Flow Soldering
6-3. Manual Soldering Manual Soldering can pose a great risk of creating thermal cracks in chip capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operator's carelessness may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip. 6-4.Amount of Solder Too much solder Cracks tend to occur due to large stress
Amount of solder is adequate
Maximum amount of solder Minimum amount of solder
Not enough solder
Weak holding force may cause bad connections or detaching of the capacitor
6-5. Cooling Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning, the temperature difference (T) must be less than 100C.
6-6. Cleaning If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used, chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the chip capacitors. This means that the cleaning fluid must be carefully selected, and should always be new.
7. Notes for Separating Multiple, Shared PC Boards A multi-PC board is separated into many individual circuit boards after soldering has been completed. If the board is bent or distorted at the time of separation, cracks may occur in the chip capacitors. Carefully choose a separation method that minimizes the bending of the circuit board.
19
Cal-Chip
Electronics, Incorporated
GMC SERIES
Multilayer Ceramic Chip Capacitors APPLICATION INFORMATION ON SOLDER PAD DESIGN FOR SURFACE MOUNT CHIP CAPACITOR Recommended Pad Dimensions
Dimensions (inches)
Chip Size
0402* 0603* 0805 1206 1210 1812* 1825* 2220 2225* 3640*
L
0.021 0.035 0.040 0.040 0.040 0.050 0.050 0.050 0.050 0.060
W
0.022 0.030 0.050 0.065 0.100 0.120 0.250 0.250 0.250 0.400
S
0.017 0.030 0.040 0.080 0.080 0.130 0.130 0.130 0.170 0.300
T
0.059 0.100 0.120 0.160 0.160 0.230 0.230 0.230 0.270 0.420
*These sizes are recommended for use with IR and vapor phase soldering only.
NOTICE: Specifications are subject to change without notice. Contact your nearest Cal-Chip Sales Office for the latest specifications. All statements, information and data given herein are believed to be accurate and reliable, but are presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements or suggestions concerning possible use of our products are made without representation or warranty that any such use is free of patent infringement and are not recommendations to infringe any patent. The user should not assume that all safety measures are indicated or that other measures may not be required. Specifications are typical and may not apply to all applications.
20

▲Up To Search▲

Price & Availability of GMC40XXXX

	To Download GMC40XXXX Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .